
|
| |
|
FURNACE
ENTRY
TIME |
LOW TEMP |
VACUUM
START
TEMP |
HEAT
RATE
DEG/MIN |
HIGH
TEMP |
VACUUM
RELEASE
TEMP |
HOLD
TIME
(AIR) |
| WOP
CREAPAST1 |
6-8 MIN. |
1110° F
600° C |
1110° F
600° C |
145° F
80° C |
1740° F
950° C |
1740° F
950° C |
1 MIN. |
1ST
POWDER / FULL
OPAQUE2 |
2-6 MIN. |
1110° F
600° C |
1110° F
600° C |
145° F
80° C |
1795° F
980° C |
1795° F
980° C |
1 MIN. |
2ND
POWDER/FULL
OPAQUE |
2-6 MIN. |
1110° F
600° C |
1110° F
600° C |
145° F
80° C |
1740° F
950° C |
1740° F
950° C |
1 MIN. |
| 1st
PASTE OPAQUE2 |
6-8 MIN. |
1020° F
550° C |
1020° F
550° C |
145° F
80° C |
1795° F
980° C |
1795° F
980° C |
1 MIN. |
| 2nd
PASTE OPAQUE |
6-8 MIN. |
1020° F
550° C |
1020° F
550° C |
145° F
80° C |
1740° F
950° C |
1740° F
950° C |
1 MIN. |
| 1st
AND 2nd SHOULDER FIRING |
2-6 MIN. |
1110° F
600° C |
1110° F
600° C |
145° F
80° C |
1740° F
950° C |
1740° F
950° C |
1 MIN. |
| 1st
DENTIN FIRING |
4-8 MIN. |
1075° F
580° C |
1075° F
580° C |
100° F
55° C |
1690° F
920° C |
1690° F
920° C |
1 MIN. |
| 2nd
DENTIN FIRING |
2-6 MIN. |
1075° F
580° C |
1075° F
580° C |
100° F
55° C |
1670° F
910° C |
1670° F
910° C |
|
SELF
GLAZE
(Without glaze powder) |
2 MIN. |
1110° F
600° C |
No
Vacuum |
100° F
55° C |
1705° F
930° C |
N/A |
|
GLAZE
WITH
GLAZE POWDER |
2-6 MIN. |
1110° F
600° C |
No Vacuum |
100° F
55° C |
1650° F
900° C |
N/A |
|
| POST
SOLDERING3 |
2 MIN. |
1110° F
600° C |
No Vacuum |
100° F
55° C |
1560° F
850° C |
N/A |
|
(1) WOP Creapast replaces the
first opaque firing of powder opaque or "regular" Creapast.
(2) Raise high temperature of 1st Opaque only by
36° F(20° C) when firing onto non-precious
alloy.
(3) The soldering investment patty should be as
small as possible. Pre-dry in a burnout furnace for
20 minutes at 800° F (425° C). Then, transfer
the case to the porcelain furnace. Once the soldering
cycle has been completed, the soldered restoration
must be removed immediately and cooled rapidly.
(4) A minimum of six minutes furnace entry time
must be used when the Universal Liquid or In Nova
fluids are used.
Revision
0, 7/10/00 |